Packaging of High Power Semiconductor Lasers
Xingsheng Liu · Wei Zhao · Lingling Xiong · Hui Liu
Jul 2014 · Springer
Ebook
402
Pages
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About this ebook
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
About the author
Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.
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