Micromachined Ultrasound-Based Proximity Sensors
Mark R. Hornung · Oliver Brand
des. del 2012 · Microsystems Llibre 4 · Springer Science & Business Media
Llibre electrònic
121
Pàgines
reportNo es verifiquen les puntuacions ni les ressenyes Més informació
Sobre aquest llibre
Micromachined Ultrasound-Based Proximity Sensors presents a packaged ultrasound microsystem for object detection and distance metering based on micromachined silicon transducer elements. It describes the characterization, optimization and the long-term stability of silicon membrane resonators as well as appropriate packaging for ultrasound microsystems.
Micromachined Ultrasound-Based Proximity Sensors describes a cost-effective approach to the realization of a micro electro mechanical system (MEMS). The micromachined silicon transducer elements were fabricated using industrial IC technology combined with standard silicon micromachining techniques. Additionally, this approach allows the cointegration of the driving and read-out circuitry. To ensure the industrial applicability of the fabricated transducer elements intensive long-term stability and reliability tests were performed under various environmental conditions such as high temperature and humidity.
Great effort was undertaken to investigate the packaging and housing of the ultrasound system, which mainly determine the success or failure of an industrial microsystem. A low-stress mounting of the transducer element minimizes thermomechanical stress influences. The developed housing not only protects the silicon chip but also improves the acoustic performance of the transducer elements.
The developed ultrasound proximity sensor system can determine object distances up to 10 cm with an accuracy of better than 0.8 mm.
Micromachined Ultrasound-Based Proximity Sensors will be of interest to MEMS researchers as well as those involved in solid-state sensor development.
Micromachined Ultrasound-Based Proximity Sensors describes a cost-effective approach to the realization of a micro electro mechanical system (MEMS). The micromachined silicon transducer elements were fabricated using industrial IC technology combined with standard silicon micromachining techniques. Additionally, this approach allows the cointegration of the driving and read-out circuitry. To ensure the industrial applicability of the fabricated transducer elements intensive long-term stability and reliability tests were performed under various environmental conditions such as high temperature and humidity.
Great effort was undertaken to investigate the packaging and housing of the ultrasound system, which mainly determine the success or failure of an industrial microsystem. A low-stress mounting of the transducer element minimizes thermomechanical stress influences. The developed housing not only protects the silicon chip but also improves the acoustic performance of the transducer elements.
The developed ultrasound proximity sensor system can determine object distances up to 10 cm with an accuracy of better than 0.8 mm.
Micromachined Ultrasound-Based Proximity Sensors will be of interest to MEMS researchers as well as those involved in solid-state sensor development.
Puntua aquest llibre electrònic
Dona'ns la teva opinió.
Informació de lectura
Telèfons intel·ligents i tauletes
Instal·la l'aplicació Google Play Llibres per a Android i per a iPad i iPhone. Aquesta aplicació se sincronitza automàticament amb el compte i et permet llegir llibres en línia o sense connexió a qualsevol lloc.
Ordinadors portàtils i ordinadors de taula
Pots escoltar els audiollibres que has comprat a Google Play amb el navegador web de l'ordinador.
Lectors de llibres electrònics i altres dispositius
Per llegir en dispositius de tinta electrònica, com ara lectors de llibres electrònics Kobo, hauràs de baixar un fitxer i transferir-lo al dispositiu. Segueix les instruccions detallades del Centre d'ajuda per transferir els fitxers a lectors de llibres electrònics compatibles.
