Electromigration Modeling at Circuit Layout Level
mar, 2013 · Springer Science & Business Media
E-kitob
103
Sahifalar soni
reportReytinglar va sharhlar tasdiqlanmagan Batafsil
Bu e-kitob haqida
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
Bu e-kitobni baholang
Fikringizni bildiring.
Qayerda o‘qiladi
Smartfonlar va planshetlar
Android va iPad/iPhone uchun mo‘ljallangan Google Play Kitoblar ilovasini o‘rnating. U hisobingiz bilan avtomatik tazrda sinxronlanadi va hatto oflayn rejimda ham kitob o‘qish imkonini beradi.
Noutbuklar va kompyuterlar
Google Play orqali sotib olingan audiokitoblarni brauzer yordamida tinglash mumkin.
Kitob o‘qish uchun mo‘ljallangan qurilmalar
Kitoblarni Kobo e-riderlar kabi e-siyoh qurilmalarida oʻqish uchun faylni yuklab olish va qurilmaga koʻchirish kerak. Fayllarni e-riderlarga koʻchirish haqida batafsil axborotni Yordam markazidan olishingiz mumkin.
