Dislocations, Mesoscale Simulations and Plastic Flow
Ladislas Kubin
Apr 2013 · Oxford Series on Materials Modelling Kitabu cha 5 · OUP Oxford
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In the past twenty years, new experimental approaches, improved models and progress in simulation techniques brought new insights into long-standing issues concerning dislocation-based plasticity in crystalline materials. During this period, three-dimensional dislocation dynamics simulations appeared and reached maturity. Their objectives are to unravel the relation between individual and collective dislocation processes at the mesoscale, to establish connections with atom-scale studies of dislocation core properties and to bridge, in combination with modelling, the gap between defect properties and phenomenological continuum models for plastic flow. Dislocation dynamics simulations are becoming accessible to a wide range of users. This book presents to students and researchers in materials science and mechanical engineering a comprehensive coverage of the physical body of knowledge on which they are based. It includes classical studies, which are too often ignored, recent experimental and theoretical advances, as well as a discussion of selected applications on various topics.
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Ladislas Kubin received his Engineering Diploma from Ecole Centrale Paris in 1966 and his Doctorate in Physical Sciences from Orsay University (Solid State Physics Laboratory) in 1971. Since 1968, he held a full-time research position at CNRS, where he is now Director of Research Emeritus. His research was performed in several laboratories affiliated to CNRS, in Orsay, Toulouse, Poitiers and, since 1988, at the joint CNRS-ONERA unit in Châtillon, near Paris. He is CNRS bronze and silver medalist and Gay-Lussac - von Humboldt awardee. His domains of interest are elementary and collective dislocation properties, mesoscale modelling of dislocations, dislocation dynamics simulations and multi-scale modelling of plasticity. He contributed to the development of the first dislocation dynamics simulations in 2D, 2.5D and 3D.
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