Through-Silicon Vias for 3D Integration

Make: Electronics: Learning Through Discovery

Semiconductor Advanced Packaging

Beginner's Guide to Reading Schematics, Third Edition: Edition 3

Fan-Out Wafer-Level Packaging

Circuitbuilding Do-It-Yourself For Dummies

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Arduino: A Begineer's Guide

Chiplet Design and Heterogeneous Integration Packaging

3D IC Integration and Packaging

Electronic Components and Circuits Lab

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

FPGA Prototyping by SystemVerilog Examples: Xilinx MicroBlaze MCS SoC Edition, Edition 2

Practical Electronics: Components and Techniques: Components and Techniques

Assembly and Reliability of Lead-Free Solder Joints

Communications Circuits Experiments

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Introduction to Oscillators

Microvias: For Low Cost, High Density Interconnects