Through-Silicon Vias for 3D Integration

Making Things Move DIY Mechanisms for Inventors, Hobbyists, and Artists

Semiconductor Advanced Packaging

Electricity Demystified, Second Edition: Edition 2

Fan-Out Wafer-Level Packaging

22 Radio and Receiver Projects for the Evil Genius

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Simple Technology to Support Research

Chiplet Design and Heterogeneous Integration Packaging

Getting Started with Zoom: A Beginners Guide to Videoconferencing

Heterogeneous Integrations

Electronic Gadgets for the Evil Genius: 21 Build-It-Yourself Projects, Second Edition, Edition 2

3D IC Integration and Packaging

Build Your Own Teams of Robots with LEGO® Mindstorms® NXT and Bluetooth®

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

15 Dangerously Mad Projects for the Evil Genius

WhatsApp in the World: Disinformation, Encryption, and Extreme Speech

Assembly and Reliability of Lead-Free Solder Joints

Kinect Open Source Programming Secrets: Hacking the Kinect with OpenNI, NITE, and Java

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration