Through-Silicon Vias for 3D Integration

Encyclopedia of Electronic Components Volume 1: Resistors, Capacitors, Inductors, Switches, Encoders, Relays, Transistors

Semiconductor Advanced Packaging

Encyclopedia of Electronic Components Volume 2: LEDs, LCDs, Audio, Thyristors, Digital Logic, and Amplification

Fan-Out Wafer-Level Packaging

Instrument Engineers' Handbook, Volume One: Process Measurement and Analysis, Edition 4

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Proceedings of 8th Edition of International Conference on Chemistry Science and Technology 2018: Journal of Archives in Chemical Research : Volume 2

Chiplet Design and Heterogeneous Integration Packaging

Heterogeneous Integrations

Make: Electronics: Learning Through Discovery

3D IC Integration and Packaging

Advanced Cleaning Product Formulations, Vol. 1: Volume 1

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Buddhism and the fourth industrial revolution

Assembly and Reliability of Lead-Free Solder Joints

Mud Engineering Simplified

Microvias: For Low Cost, High Density Interconnects