Through-Silicon Vias for 3D Integration

Encyclopedia of Electronic Components Volume 1: Resistors, Capacitors, Inductors, Switches, Encoders, Relays, Transistors

Chiplet Design and Heterogeneous Integration Packaging

Encyclopedia of Electronic Components Volume 2: LEDs, LCDs, Audio, Thyristors, Digital Logic, and Amplification

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Heterogeneous Integrations

HVAC for Semiconductor FAB & Exhaust Management

Fan-Out Wafer-Level Packaging

3D IC Integration and Packaging

Encyclopedia of Electronic Components Volume 3: Sensors for Location, Presence, Proximity, Orientation, Oscillation, Force, Load, Human Input, Liquid and Gas Properties, Light, Heat, Sound, and Electricity

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Physics and Applications of CVD Diamond

Assembly and Reliability of Lead-Free Solder Joints

Logic Application Handbook: Product Features and Application Insights

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Microvias: For Low Cost, High Density Interconnects